doc: Changes related to the RPP board

Some text was written for HDK and is not valid for RPP. This text was
either fixed or removed.

diff --git a/doc/_tms570_rpp/hwdesc.tex b/doc/_tms570_rpp/hwdesc.tex
index 6f431f2ef9ffb867411a94d52d63c136d18dee58..820c313493d704dee5c84985aca4f6b87efb3812 100644 (file)
--- a/doc/_tms570_rpp/hwdesc.tex
+++ b/doc/_tms570_rpp/hwdesc.tex
@@ -1,75 +1,73 @@
 This section provides a brief description of the \tgtBoardName{}
-board. For a more detailed information refer to \cite{\tgtBoardDoc}.
-The kit is depicted in Figure~\ref{fig-board_photo}.
+board. For a more detailed information refer to \cite{michalhorn2013}.
+The RPP board is depicted in Figure~\ref{fig-board_photo}.
 
 \begin{figure}\begin{center}
        \noindent
-       \includegraphics[width=300px]{images/board.png}
-       \caption{The \tgtBoardName{} \cite[p. 8]{\tgtBoardDoc}}
+       \includegraphics[width=300px]{images/board-photo.png}
+       \caption{The \tgtBoardName{} \cite[p. 8]{michalhorn2013}}
        \label{fig-board_photo}
 \end{center}\end{figure}
 
 A block diagram in Figure~\ref{fig-blocks} ilustrates the supported
 peripherals and their connection to the MCU, expansion connectors and
-other components on the development kit. For pinout description of the
-implemented peripherals refer the \tgname{} HDK User's Guide
-\cite{\tgtBoardDoc}. The main features of supported peripherals are
-provided in the following subsections.
+other components on the board. % The main features of supported
+% peripherals are provided in the following subsections.
 
 \begin{figure}\begin{center}
        \noindent
-       \includegraphics[width=400px]{images/blocks.png}
+       \includegraphics[width=400px]{images/blocks.pdf}
        \caption{Block diagram of supported peripherals}
        \label{fig-blocks}
 \end{center}\end{figure}
 
-\subsection{Digital Inputs and Outputs (DIN and DOUT)}
-\label{par-digital-inputs-outputs}
- \begin{compactitem}
-       \item 46 pins available on Expansion connector J11.
-       \item 8 pins available on GIOA
-       \item 8 pins available on GIOB
-       \item 30 pins available on NHET1. Pins NHET1 6 and NHET1 13 are disabled.
-       \item All the pins are configurable as inputs and outputs with different modes:
-        \begin{compactitem}
-               \item Push/Pull or Open Drain for Output configuration.
-               \item Pull up, Pull down or tri-stated for Input configuration.
-        \end{compactitem}
-   \item Some of the pins are connected to LEDs or to a button. See
-     Figure~\ref{fig-blocks} or refer to~\cite{\tgtBoardDoc}.
- \end{compactitem}
+% \subsection{Digital Inputs and Outputs (DIN and DOUT)}
+% \label{par-digital-inputs-outputs}
+%  \begin{compactitem}
+%      \item 46 pins available on Expansion connector J11.
+%      \item 8 pins available on GIOA
+%      \item 8 pins available on GIOB
+%      \item 30 pins available on NHET1. Pins NHET1 6 and NHET1 13 are disabled.
+%      \item All the pins are configurable as inputs and outputs with different modes:
+%       \begin{compactitem}
+%              \item Push/Pull or Open Drain for Output configuration.
+%              \item Pull up, Pull down or tri-stated for Input configuration.
+%       \end{compactitem}
+%    \item Some of the pins are connected to LEDs or to a button. See
+%      Figure~\ref{fig-blocks} or refer to~\cite{\tgtBoardDoc}.
+%  \end{compactitem}
 
-\subsection{Analog Input (ADC)}
-\label{par-analog-input}
-\vbox{% Keep this on the same page
- \begin{compactitem}
-       \item 16 channels available on the Expansion connector J9.
-       \item Range for 0 -- 5 Volts.
-       \item 12 bits resolution.
- \end{compactitem}
-}
-\subsection{CAN bus (CAN)}
-\label{par-can}
-\begin{compactitem}
-    \item Up to three CAN ports
-      \begin{compactitem}
-      \item 2 ports equipped with physical layer CAN transciever
-        connected to J2 and J3 connectors.
-      \item All 3 ports available as link-level interface on the
-        Expansion connector J11.
-      \end{compactitem}
-       \item High speed.
-       \item Recovery from errors.
-       \item Detection of network errors.
-\end{compactitem}
+% \subsection{Analog Input (ADC)}
+% \label{par-analog-input}
+% \vbox{% Keep this on the same page
+%  \begin{compactitem}
+%      \item 16 channels available on the Expansion connector J9.
+%      \item Range for 0 -- 5 Volts.
+%      \item 12 bits resolution.
+%  \end{compactitem}
+% }
+% \subsection{CAN bus (CAN)}
+% \label{par-can}
+% \begin{compactitem}
+%     \item Up to three CAN ports
+%       \begin{compactitem}
+%       \item 2 ports equipped with physical layer CAN transciever
+%         connected to J2 and J3 connectors.
+%       \item All 3 ports available as link-level interface on the
+%         Expansion connector J11.
+%       \end{compactitem}
+%      \item High speed.
+%      \item Recovery from errors.
+%      \item Detection of network errors.
+% \end{compactitem}
 
-\subsection{Serial Communication Interface (SCI)}
-\label{par-sci}
-\begin{compactitem}
-       \item 1 port available on connector J7.
-       \item Configurable baud rate. Tested with 9600 and 115200 bps.
-       \item RS232 compatible.
-\end{compactitem}
+% \subsection{Serial Communication Interface (SCI)}
+% \label{par-sci}
+% \begin{compactitem}
+%      \item 1 port available on connector J7.
+%      \item Configurable baud rate. Tested with 9600 and 115200 bps.
+%      \item RS232 compatible.
+% \end{compactitem}
 
 %%% Local Variables:
 %%% mode: latex

diff --git a/doc/rpp_simulink.tex b/doc/rpp_simulink.tex
index 647e6217160cc139763c81219905d53ccc3a4d83..e7318d918acedc974bb92137a746f5dabc2ee117 100644 (file)
--- a/doc/rpp_simulink.tex
+++ b/doc/rpp_simulink.tex
@@ -238,10 +238,9 @@ consists of code generation target for Simulink Embedded Coder, a
 low-level run-time C library and a tool for interactive testing of
 hardware and software functionality.
 
-Originally, the RPP project was created for a custom TMS570-based board
-and the port to other platforms such as RM48 HDK and TMS570 HDK
-development kits. Porting to other platforms was done under a contract
-from Eaton Corporation.
+Originally, the RPP project was created for a custom TMS570-based
+board. Subsequently, it was ported to other board such as RM48 HDK and
+TMS570 HDK development kits under a contract from Eaton Corporation.
 
 The document contains step-by-step instructions for installation of
 development tools, information about Simulink Coder configuration,
@@ -336,7 +335,7 @@ upper layers.
 % exclusively on the bottom layer, not on any lower level layer (except for a
 % couple of exceptions).
 \item Each layer should provide a unified layer interface
-  (\texttt{rpp.h}, \texttt{drv.h}, \texttt {hal.h}, \texttt{sys.h} and
+  (\texttt{rpp.h}, \texttt{drv.h}, \texttt{sys.h} and
   \texttt{os.h}), so that higher layers depend on the lower layer's interface
   and not on individual elements from that layer.
 \end{compactitem}
@@ -353,7 +352,7 @@ upper layers.
 As a consequence of this division the source code files and interface files are
 placed in private directories like \texttt{drv/din.h}. With this organization
 user applications only needs to include the top layer interface files (for
-example \texttt{rpp/rpp\_can.h}) to be able to use the selected library API.
+example \texttt{rpp/rpp.h}) to be able to use the selected library API.
 
 The rest of the section provides basic description of each layer.