1.3 interface for binding a thermal zone device with a thermal cooling device
1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
- int trip, struct thermal_cooling_device *cdev);
+ int trip, struct thermal_cooling_device *cdev,
+ unsigned long upper, unsigned long lower);
This interface function bind a thermal cooling device to the certain trip
point of a thermal zone device.
cdev: thermal cooling device
trip: indicates which trip point the cooling devices is associated with
in this thermal zone.
+ upper:the Maximum cooling state for this trip point.
+ THERMAL_NO_LIMIT means no upper limit,
+ and the cooling device can be in max_state.
+ lower:the Minimum cooling state can be used for this trip point.
+ THERMAL_NO_LIMIT means no lower limit,
+ and the cooling device can be in cooling state 0.
1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
int trip, struct thermal_cooling_device *cdev);